PCB Production Process

PCB Production Process

Cut Lamination→Drilling→Photo Process(D/F)→Lamination→Copper eduction→Horizontal Electrolytic Plating→Plug Hole→Solder Mask→Gold Plating→Hot Air Solder Leveling→Profile→Electrical Testing→Final Visual Inspection→Laser Ablation

1. Cut Lamination

   a-1. Sheets Cutting

   a-2. Panel(Shear material to size)

    

2. Drilling

   b-1 Inner Layer Drilling

   b-2 Outer Layer Drilling

   b-3 2nd Drilling

   b-4 Laser Drilling(Laser Ablation)

   b-5 Blind & Buried Hole Drilling

    

3. Photo Process(D/F)

   c-1. Pretreatment

   c-2. Dry Film Lamination

   c-3. Exposure

   c-4. Developing

   c-5. Etching

   c-6. Stripping

   c-7. Touch-up

   c-8. Chemical Milling

   c-9. Selective Gold Dry Film Lamination

   c-10. Developing

   c-11. Stripping

    

4. Lamination

   d-1. Black Oxide Treatment

   d-2. Microetching

   d-3. Eyelet

   d-4. Lay up

   d-5. Lamination

   d-6. Post Treatment

   d-7. Black Oxide Removal

   d-8. Spot face

   d-9. Resin flush removal

    

5. Copper Reduction

6. Horizontal Electrolytic Plating

   f-1. Horizontal Electro-Plating(Panel Plating)

   f-2. Tin-Lead Plating(Pattern Plating)

   f-3. Less than 1 mil Thickness

   f-4. More than 1 mil Thickness

   f-5. Belt Sanding

   f-6. Tin-Lead Stripping

   f-7. Microsection

    

7. Plug Hole

   g-1. Ink Print

   g-2. Precure

   g-3. Scrub

   g-4. Postcure

    

8. Solder Mask

   h-1. Printing Top Side

   h-2. Printing Bottom Side

   h-3. Spray Coating

   h-4. Pretreatment

   h-5. Precure

   h-6. Exposure

   h-7. Develop

   h-8. Postcure

   h-9. UV Cure

   h-10. Printing of Legend

   h-11. Pumice(Wet Blasting)

   h-12. Peelable Solder Mask

    

9. Gold plating

   i-1. Gold Finger

   i-2. Soft Ni/Au Plating

   i-3. Immersion Ni/Au(Electroless Ni/Au)

    

10. Hot Air Solder Leveling

    j-1. Horizontal Hot Air Solder Leveling

    j-2. Vertical Hot Air Solder Leveling

    j-3. Super Solder

    j-4. Solder Bump

     

11. Profile(Form)
    k-1. N/C Routing(Milling)
    k-2. Punch
    k-3. Cleaning & Backing
    k-4. V-Cut(V-Scoring)
    k-5 Beveling of G/F
12. L. Electrical Testing(Continuity & Insulation Testing)
    l-1. AOI Inspection
    l-2. Verified & Repaired)
    l-3. Universal Tester
    l-4. Dedicated Tester
    l-5. Flying Probe
    M. Final Visual Inspection