| Base material type |
CEM-1/CEM-3/FR-4/FR4 high Tg series/MPCB/FPC |
| Max panel size |
1200*3mm |
| Min inner layer lline wedth/space |
0.075/0.075mm(3mil/3mil) |
| Copper thickness |
0.5oz-4oz |
| Final board thickness |
0.4-4.0mm |
| Layer Count |
1-28 layer |
| Inner layer registration |
50um(2mil) |
| Min mechanical drill size |
0.15mm |
| Max PTH aspect ratio |
10:00. |
| Surface Treatment |
HALS,Gold,Finger,Plating Gold,OSP,ENIG,IMM,TIN,IMM AG |
| Etching tolerance |
10% |
| Min solder mask dam |
100um(4 mil) |
| Gold Thickness of immersin gold |
0.025-0.075(1-3u’’) |
| Warp and twist |
≤0.75% |
| Fastest samole speed |
Double=8 hour 4layer=24 hour |
Post time: Sep-29-2018